Efficacy of Copper Compounds on Transmitted by Seed of Different Dry Bean Cultivars against Xanthomonas axonopodis pv. phaseoli

Authors

  • Ayşegül Gür Selcuk University, Faculty of Agriculture Dept. of Plant Protection, Campus/Konya
  • Kubilay Kurtulus Bastas Selcuk University, Faculty of Agriculture Dept. of Plant Protection, Campus/Konya

Keywords:

dry bean, copper, seed, Xanthomonas, control

Abstract

Dry beans, which have an important place in human nutrition, are mostly produced in the Central Anatolia Region with a rate of 56.8% in our country. Common bean bacterial blight disease caused by Xanthomonas axonopodis pv. phaseoli (Xap), which is carried by bean seeds, causes significant economic losses under favorable climatic conditions. The disease has started to be seen at high rates in our cultivation areas, especially in the areas where sprinkler irrigation is applied and in the increasing temperature conditions due to the climate crisis. In this study, efficacy of several copper compounds in seeds of 3 different bean cultivars were determined in comparison with antibiotic  in order to prevent the disease / reduce economic losses. According to the findings, copper oxychloride was found to be the most successful compound in seeds of all bean varieties, both in reducing bacterial populations in vitro and in preventing the disease in vivo. Considering the negative effects of copper use in terms of human and environmental health and the risks of copper resistance in the pathogen, it is thought that the success in combating the increasingly common bean blight disease will increase with the use of the most effective copper compound in eco-friendly approaches.

Published

05-10-2023

How to Cite

Gür, A., & Bastas, K. K. (2023). Efficacy of Copper Compounds on Transmitted by Seed of Different Dry Bean Cultivars against Xanthomonas axonopodis pv. phaseoli. III. International Congress of the Turkish Journal of Agriculture - Food Science and Technology, Malatya, Türkiye, 312–316. from http://turjaf.com/index.php/TURSTEP/article/view/183